标签：电子行业标准,http://www.5idzw.com
电子组装的IPC标准列表,http://www.5idzw.com
General Requirements for Thermally Conductive Adhesives
导热胶粘剂通用要求
IPC-3406Guidelines for Electrically Conductive Surface Mount Adhesives
表面贴装导电胶使用指南
IPC-3408General Requirements for Anisotropically Conductive Adhesives Films
各向异性导电胶膜的一般要求
IPC-CC-830BQualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies
印制板组装电气绝缘性能和质量手册IPC-HDBK-830Guideline for Design, Selection and Application of Conformal Coatings
敷形涂层的设计，选择和应用手册
IPC-SM-840CQualification and Performance of Permanent Solder Mask - Includes Amendment 1
永久性阻焊剂的鉴定及性能(包括修改单1)IPC-HDBK-840Guide to Solder Paste Assessment
焊膏性能评价手册ELEC-MICROHandbook of Lead Free Solder Technology for Microelectronic Assemblies
微电子组装无铅焊接技术手册IPC-TP-1114The Layman’s Guide to Qualifying a Process to J-STD-001
基于J-STD-001组装工艺雷氏选择法
IPC-AJ-820Assembly & Joining Handbook
装联手册IPC-7530Guidelines for Temperature Profiling for Mass Soldering (Reflow & Wave) Processes
大规模焊接(回流焊与波峰焊)过程温度曲线指南IPC-TP-1090The Layman’s Guide to Qualifying New Fluxes
新型助焊剂雷氏选择法IPC-TP-1115Selection and Implementation Strategy for a Low-Residue No-Clean Process
低残留不清洗工艺的选择和实施IPC-S-816SMT Process Guideline & Checklist
表面安装技术过程导则及检核表IPC-TR-460ATrouble-Shooting Checklist for Wave Soldering Printed Wiring Boards
印制板波峰焊故障排除检查表IPC-CM-770EComponent Mounting Guidelines for Printed Boards
印制板元件安装导则
IPC-7912ACalculation of DPMO & Manufacturing Indices for Printed Board Assemblies
印制板和电子组装件每百万件缺陷数(DPMO)和制造指数的计算
IPC-9261In-Process DPMO and Estimated Yield for PWAs
印制板组装过程中每百万件缺陷数(DPMO)及合格率估计
IPC-DPMO-202IPC-7912/9261 End Item and In Process DPMO Set
IPC-7912A 和IPC-9261合订本IPC-9500-KAssembly Process Component Simulations, Guidelines & Classifications Package
组装过程中元件仿真, 规则分类IPC-9501PWB Assembly Process Simulation for Evaluation of Electronic Components 电子元件的印制板组装过程模拟评价IPC-9502PWB Assembly Soldering Process Guideline for Electronic Components
电子元件的印制板组装焊接过导则
IPC-9503Moisture Sensitivity Classification for Non-IC Components
非集成电路元件的湿度敏感度分级
IPC-9504Assembly Process Simulation for Evaluation of Non-IC Components (Preconditioning Non-IC Components)
非集成电路元件的组装过程模拟评价（非集成电路元件预处理）
IPC-9850-KSurface Mount Placement Equipment Characterization-KIT
表面贴装设备性能检测方法的描述（附Gerber格式CD盘）
IPC-9850-TM-KW, IPC-9850-TM-KTest Materials Kit for Surface Mount Placement Equipment Standardization
表面贴装设备性能测试用的标准工具包
• 4 IPC-9850 Placement Accuracy Verification Panels
• 1 IPC-9850 CMM Measurement Verification Panels
• 150 IPC-9850 QFP-100 Glass Components
• 130 IPC-9850 QFP-208 Glass Components
• 150 IPC-9850 BGA-228 Glass Components
• NIST Traceable Measurement Certificate
• Custom Storage Case
IPC-7711/21A电子组装件的返工与返修IPC/EIA J-STD-002BSolderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires
元件引线、端子、焊片、接线柱及导线可焊性试验IPC/EIA J-STD-003ASolderability Tests for Printed Boards
印制板可焊性试验IPC-TR-461Trouble-Shooting Checklist for Wave Soldering Printed Wiring Boards
印制板波峰焊故障排除检查表
IPC-TR-462Solderability Evaluation of Printed Boards with Protective Coatings Over Long-term Storage
带保护性涂层印制板长期贮存的可焊性评价IPC-TR-464Accelerated Aging for Solderability Evaluations
可焊性加速老化评价(附修订)IPC-TR-465-1Round Robin Test on Steam Ager Temperature Control Stability
蒸汽老化器温度控制稳定性联合试验
IPC-TR-465-2The Effect of Steam Aging Time and Temperature on Solderability Test Results
蒸汽老化时间与温度对可焊性试验结果的影响IPC-TR-465-3Evaluation of Steam Aging on Alternative Finishes, Phase IIA
替代涂覆层的蒸汽老化评价
IPC-TR-466Technical Report: Wetting Balance Standard Weight Comparison Test
技术报告: 润湿天平称重标准对比测试
SMC-WP-001Soldering Capability White Paper Report
可焊性工艺导论SMC-WP-005PCB Surface Finishes
印制电路板表面清洗，电子组装的IPC标准列表
General Requirements for Thermally Conductive Adhesives
导热胶粘剂通用要求
IPC-3406Guidelines for Electrically Conductive Surface Mount Adhesives
表面贴装导电胶使用指南
IPC-3408General Requirements for Anisotropically Conductive Adhesives Films
各向异性导电胶膜的一般要求
IPC-CC-830BQualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies
印制板组装电气绝缘性能和质量手册IPC-HDBK-830Guideline for Design, Selection and Application of Conformal Coatings
敷形涂层的设计，选择和应用手册
IPC-SM-840CQualification and Performance of Permanent Solder Mask - Includes Amendment 1
永久性阻焊剂的鉴定及性能(包括修改单1)IPC-HDBK-840Guide to Solder Paste Assessment
焊膏性能评价手册ELEC-MICROHandbook of Lead Free Solder Technology for Microelectronic Assemblies
微电子组装无铅焊接技术手册IPC-TP-1114The Layman’s Guide to Qualifying a Process to J-STD-001
基于J-STD-001组装工艺雷氏选择法
IPC-AJ-820Assembly & Joining Handbook
装联手册IPC-7530Guidelines for Temperature Profiling for Mass Soldering (Reflow & Wave) Processes
大规模焊接(回流焊与波峰焊)过程温度曲线指南IPC-TP-1090The Layman’s Guide to Qualifying New Fluxes
新型助焊剂雷氏选择法IPC-TP-1115Selection and Implementation Strategy for a Low-Residue No-Clean Process
低残留不清洗工艺的选择和实施IPC-S-816SMT Process Guideline & Checklist
表面安装技术过程导则及检核表IPC-TR-460ATrouble-Shooting Checklist for Wave Soldering Printed Wiring Boards
印制板波峰焊故障排除检查表IPC-CM-770EComponent Mounting Guidelines for Printed Boards
印制板元件安装导则
IPC-7912ACalculation of DPMO & Manufacturing Indices for Printed Board Assemblies
印制板和电子组装件每百万件缺陷数(DPMO)和制造指数的计算
IPC-9261In-Process DPMO and Estimated Yield for PWAs
印制板组装过程中每百万件缺陷数(DPMO)及合格率估计
IPC-DPMO-202IPC-7912/9261 End Item and In Process DPMO Set
IPC-7912A 和IPC-9261合订本IPC-9500-KAssembly Process Component Simulations, Guidelines & Classifications Package
组装过程中元件仿真, 规则分类IPC-9501PWB Assembly Process Simulation for Evaluation of Electronic Components 电子元件的印制板组装过程模拟评价IPC-9502PWB Assembly Soldering Process Guideline for Electronic Components
电子元件的印制板组装焊接过导则
IPC-9503Moisture Sensitivity Classification for Non-IC Components
非集成电路元件的湿度敏感度分级
IPC-9504Assembly Process Simulation for Evaluation of Non-IC Components (Preconditioning Non-IC Components)
非集成电路元件的组装过程模拟评价（非集成电路元件预处理）
IPC-9850-KSurface Mount Placement Equipment Characterization-KIT
表面贴装设备性能检测方法的描述（附Gerber格式CD盘）
IPC-9850-TM-KW, IPC-9850-TM-KTest Materials Kit for Surface Mount Placement Equipment Standardization
表面贴装设备性能测试用的标准工具包
• 4 IPC-9850 Placement Accuracy Verification Panels
• 1 IPC-9850 CMM Measurement Verification Panels
• 150 IPC-9850 QFP-100 Glass Components
• 130 IPC-9850 QFP-208 Glass Components
• 150 IPC-9850 BGA-228 Glass Components
• NIST Traceable Measurement Certificate
• Custom Storage Case
IPC-7711/21A电子组装件的返工与返修IPC/EIA J-STD-002BSolderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires
元件引线、端子、焊片、接线柱及导线可焊性试验IPC/EIA J-STD-003ASolderability Tests for Printed Boards
印制板可焊性试验IPC-TR-461Trouble-Shooting Checklist for Wave Soldering Printed Wiring Boards
印制板波峰焊故障排除检查表
IPC-TR-462Solderability Evaluation of Printed Boards with Protective Coatings Over Long-term Storage
带保护性涂层印制板长期贮存的可焊性评价IPC-TR-464Accelerated Aging for Solderability Evaluations
可焊性加速老化评价(附修订)IPC-TR-465-1Round Robin Test on Steam Ager Temperature Control Stability
蒸汽老化器温度控制稳定性联合试验
IPC-TR-465-2The Effect of Steam Aging Time and Temperature on Solderability Test Results
蒸汽老化时间与温度对可焊性试验结果的影响IPC-TR-465-3Evaluation of Steam Aging on Alternative Finishes, Phase IIA
替代涂覆层的蒸汽老化评价
IPC-TR-466Technical Report: Wetting Balance Standard Weight Comparison Test
技术报告: 润湿天平称重标准对比测试
SMC-WP-001Soldering Capability White Paper Report
可焊性工艺导论SMC-WP-005PCB Surface Finishes
印制电路板表面清洗，电子组装的IPC标准列表